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  • 专利说明
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    • 专利摘要:
    The invention relates to a chemical-mechanical polishing pad (10) having a polishing layer (20), an end-point detection window (30), a sub-pad (25) and a stacking adhesive (23). ; wherein the subpad includes a plurality of apertures (42,45,47) in optical communication with the endpoint detection window (30); and wherein the polishing surface (14) of the polishing layer (20) is adapted to polish a substrate. The invention also relates to a polishing method using this polishing pad.
    公开号:FR3033512A1
    申请号:FR1651996
    申请日:2016-03-10
    公开日:2016-09-16
    发明作者:Joseph So；Bainian Qian；Janet T Tesfai
    申请人:Rohm and Haas Electronic Materials CMP Holdings Inc；
    IPC主号:
    专利说明:

    [0001] BACKGROUND [0001] The present invention relates to chemical mechanical polishing pads having windows.  More particularly, the present invention relates to a chemical mechanical polishing pad comprising a polishing layer; an endpoint detection window; a sub-buffer; and a stacking adhesive; wherein the subpad includes a plurality of apertures in optical communication with the endpoint detection window; and wherein the polishing surface of the polishing layer is adapted to polish a substrate.  [0002] The production of semiconductors typically involves several chemical mechanical planarization (CMP) processes.  In each CMP process, a polishing pad, optionally in combination with a polishing solution, such as a slurry containing an abrasive or a non-abrasive reactive liquid, removes material from a substrate from a substrate. which planarizes or maintains the flatness to receive a subsequent layer.  The stacking of these layers combines in a way that forms an integrated circuit.  An important step in the polishing processes used in the manufacture of wafers is the determination of a polishing end point (determination of the end of the polishing operation).  As a result, various planarization endpoint detection methods have been developed, for example, methods involving in situ optical measurements of the surface of the wafer.  The optical technique includes providing the polishing pad with a window that is transparent at selected wavelengths of light.  A light beam is directed through the window onto the surface of a slab that is being processed, on which it is reflected, passes through the window again and reaches a detector.  On the basis of the feedback signal, the properties of the wafer surface can be measured to facilitate determination of the time of completion of the polishing step.  [0004] Chemical mechanical polishing pads having windows are described, for example, by Roberts in the U. Patent. S.  No.  5605760.  [0005] However, chemical mechanical polishing pad configurations having conventional windows are susceptible to increased polishing defects attributed to problems with protruding windows.  In certain polishing pad configurations having windows, the window protrudes outwardly and upwardly from the polishing pad.  It is considered that such an outward and upward projection of the window leads to increased polishing defects due to mechanical interaction between the projecting window and the substrate.  [0006] Mechano-chemical polishing pad configurations having conventional windows are also susceptible to non-uniform wear of the window during polishing of the substrate 15 and conditioning of the polishing surface of the polishing pad.  That is, with prolonged polishing and conditioning, the windows of conventional chemical mechanical polishing pads tend to have greater wear at the edges than at the center of the window.  As a result, over time 20 the thickness of the window measured perpendicular to the polishing side varies on the profile of the window.  The increased variation in the thickness of the window leads to errors in the determination of the polishing end point.  To avoid such end point errors, the polishing pads are replaced and discarded prematurely (that is, while the polishing layer still has a useful surface for polishing).  [0007] Thus, there is a continuing need for chemical mechanical polishing pad designs that mitigate window protrusion problems and non-uniform window wear associated with 3033512 3 chemical mechanical polishing pads having conventional windows.  SUMMARY OF THE INVENTION [0008] The present invention provides a chemical mechanical polishing pad comprising: a polishing layer having a central axis, an outer perimeter, a polishing surface, a base surface and a coating thickness; polishing, Tp, perpendicular to the plane of the polishing surface, measured from the polishing surface to the base surface; an end-point detection window having a polishing side, a platen side and a window thickness, Tw, perpendicular to the polishing side, measured from the polishing side to the platen side; a sub-pad having an upper surface, a lower surface, a plurality of apertures, an outer edge and a sub-pad thickness, Ts, perpendicular to the upper surface, measured from the upper surface to the lower surface; and a stacking adhesive; wherein the endpoint detection window is incorporated in the chemical mechanical polishing pad, where the polishing side is disposed toward the polishing surface of the polishing layer; wherein the stacking adhesive is disposed between the base surface of the polishing layer and the upper surface of the sub-pad; wherein the plurality of apertures are in optical communication with the end point detection window; and wherein the polishing surface of the polishing layer is adapted to polish a substrate.  The present invention provides a chemical mechanical polishing pad comprising: a polishing layer having a central axis, an outer perimeter, a polishing surface, a base surface and a polishing layer thickness, Tp, perpendicularly in the plane of the polishing surface, measured from the polishing surface to the base surface; an end point detection window having a polishing side, a platen side and a window thickness, Tw, perpendicular to the polishing side, measured from the polishing side to the platen side; a sub-pad having an upper surface, a lower surface, a plurality of apertures, an outer edge and a sub-pad thickness, Ts, perpendicular to the upper surface, measured from the upper surface to the lower surface; and a stacking adhesive; wherein the endpoint detection window is incorporated in the chemical mechanical polishing pad, where the polishing side is disposed toward the polishing surface of the polishing layer; wherein the stacking adhesive 10 is disposed between the base surface of the polishing layer and the upper surface of the sub-pad; wherein the plurality of apertures are in optical communication with the end point detection window; wherein the sub-pad further comprises a plurality of transverse members; wherein the plurality of openings are separated by the plurality of transverse members; and wherein the plurality of openings comprises at least three openings; preferably wherein the plurality of openings consists of three adjacent openings; where the three adjacent openings consist of an inner opening, a central opening and an outer opening; wherein the inner opening has an inner opening cross-sectional area, A1, parallel to the plane of the polishing surface; wherein the central aperture has a centrally opening cross-sectional area, Ac, parallel to the plane of the polishing surface; wherein the outer opening has an external opening cross-sectional area, A0, parallel to the plane of the polishing surface; wherein the plurality of transverse members consists of an inner member and an outer member; where the inner member separates the inner opening from the central opening; where the outer member separates the central opening from the outer opening; where the inner opening cross-sectional area, Ai, is substantially constant over the sub-buffer thickness, Ts; wherein the center aperture cross-sectional area, Ac, is substantially constant over the sub-buffer thickness, Ts; where the outside opening cross-sectional area, Ao, is substantially constant over the sub-buffer thickness, Ts; wherein the outer aperture has an average opening mean cross-sectional area, Ao-avg, parallel to the plane of the polishing surface on the sub-pad thickness, Ts; wherein the inner aperture has an average inner aperture cross-sectional area, Ai-avg, parallel to the plane of the polishing surface on the sub-buffer thickness, Ts; wherein the central aperture has a mean aperture mean cross-sectional area, Ac-avg, parallel to the plane of the polishing surface on the sub-buffer thickness, Ts; where 0.75 * Ao-avg 5.  Au-avg 5 1.25 * AO-avg; where 0.5 * (Ai_avg + Aa-avg).  Ac 1.25 * (Al-avg + Aa-avg); where the end point detection window has a window cross-sectional area, Wa, parallel to the plane of the polishing surface; where the window cross-sectional area, Wa, is substantially constant over the window thickness, Tw; Wherein the end point detection window has a window length, W1, parallel to the plane of the polishing surface, measured in a large window dimension, LDw, of the end point detection window; wherein the endpoint detection window has a window width, Ww, parallel to the plane of the polishing surface, measured according to a small window size, SDw, of the endpoint detection window; where the large window dimension, LDw, is perpendicular to the small window dimension, SDw; wherein the polishing layer has a radial polishing layer line, PLR, in the plane of the polishing surface, which intersects the central axis and extends through the outer perimeter of the polishing layer; wherein the endpoint detection window is embedded in the chemical mechanical polishing pad such that the large window dimension, LDw, projects a large window projection, pLDw, on the plane of the polishing surface; where the large window projection, pLDw, substantially coincides with the radial polishing layer line, PLR; Wherein the plurality of apertures have an aperture length, AL, parallel to the plane of the polishing surface, measured in a large aperture dimension, LDA, of the plurality of apertures; wherein the plurality of apertures have an aperture width, Aw, parallel to the plane of the polishing surface, measured in a small aperture size, SDA, of the plurality of apertures; where the large aperture dimension, LDA, is perpendicular to the small aperture dimension, SDA; wherein the plurality of apertures are integrated in the subpad so that the large aperture dimension, LDA, projects a large aperture projection, pLDA, on the plane of the polishing surface; where the large aperture projection, pl-DA, substantially coincides with the large window projection, pLDw; wherein the inner member has an internal limb width, Wim, parallel to the plane of the polishing surface, measured according to the large aperture dimension, LDA, of the plurality of apertures; wherein the outer member has an outer limb width, Wom, parallel to the plane of the polishing surface, measured according to the large aperture dimension, LDA, of the plurality of apertures; wherein the inner aperture has an internal aperture dimension, DI, parallel to the plane of the polishing surface, measured according to the large aperture dimension, LDA, of the plurality of apertures; wherein the outer aperture has an outer aperture dimension, C, parallel to the plane of the polishing surface, measured according to the large aperture dimension, LDA, of the plurality of apertures; wherein the aperture length, AL, of the plurality of apertures is substantially constant over the sub-pad thickness, Ts, and the aperture width, Aw, of the plurality of apertures; wherein the plurality of apertures has an average aperture length, Δi_avg, on the sub-buffer thickness, Ts, and on the aperture width, Aw, of the plurality of apertures; wherein the aperture width, Aw, of the plurality of apertures is substantially constant over the subpad thickness, Ts, and the aperture length, AL, of the plurality of apertures; wherein the plurality of apertures has an average aperture width, Aw-avg, for the plurality of apertures on the sub-buffer thickness, Ts, and the aperture length, AL, of the plurality of apertures openings; where AL-avg_ L-avg W, where AW-avg 5 5 Ww_avg; and wherein the polishing surface of the polishing layer is adapted to polish a substrate.  The present invention provides a polishing method, comprising: providing a chemical mechanical polishing apparatus having a table, a light source and a photosensor; providing a substrate; providing a chemical mechanical polishing pad according to the present invention; the installation on the table of the chemical-mechanical polishing pad with the polishing surface disposed at a distance from the table; optionally, providing a polishing medium at an interface between the polishing surface and the substrate; creating a dynamic contact between the polishing surface and the substrate, wherein at least a certain amount of material is removed from the substrate; and determining a polishing end point by transmitting light from the light source through the end-point detection window and analyzing the light reflected from the substrate, which again passes through the end-point detection window. and which is incident on the photosensor.  BRIEF DESCRIPTION OF THE DRAWINGS [0011] FIG. 1 is a representation of a perspective top view of a chemical mechanical polishing pad of the present invention.  Figure 2 is a top view of a chemical mechanical polishing pad of the present invention.  FIG. 3 is a view from above of the end-point detection window of FIG. 2.  FIG. 4 is a cutaway top view of a chemical mechanical polishing pad of the present invention along line X-X of FIG. 1.  Figure 5 is a detail of the plurality of openings of Figure 4.  Figure 6 is a representation of an elevational sectional view with tearing of a chemical mechanical polishing pad of the present invention.  [0017] Fig. 7 is a representation of an elevational sectional view of a chemical mechanical polishing pad of the present invention.  Figure 8 is a representation of an elevational sectional view with tearing of a chemical mechanical polishing pad of the present invention.  Figure 9 is a representation of a sectional elevational view of a chemical mechanical polishing pad of the present invention.  [0020] FIG. 10 is a representation of an elevational sectional view with tearing of a chemical mechanical polishing pad 20 of the present invention.  Figure 11 is a representation of a perspective top view of a chemical mechanical polishing pad of the present invention.  Figure 12 is a top view of a plurality of apertures.  Figure 13 is a top view of a plurality of openings.  Figure 14 is a top view of a plurality of openings.  Figure 15 is a top view of the polishing side of an end point detection window.  DETAILED DESCRIPTION [0026] The Applicant has surprisingly found that the windows in the chemical-mechanical polishing pads configured according to the present invention are resistant to protruding windows and non-uniform wear of the windows, which helps minimize polishing defects due to window protrusion and maximizing the life of the polishing pads by reducing non-uniform window wear and premature removal of the associated polishing pads.  The term "total thickness, TT" as used herein with reference to a chemical mechanical polishing pad (10) having a polishing layer (20) with a polishing surface (14) means 15 thickness of the chemical mechanical polishing pad measured in a direction perpendicular to the polishing surface (14), from the polishing surface (14) to the bottom surface (27) of the sub-pad (25).  (See Figures 1 and 6-10).  The term "average total thickness, TT. As used herein with reference to a chemical-mechanical polishing pad (10) having a polishing layer (20) with a polishing surface (14) means the average of the total thickness, TT, a chemical mechanical polishing pad measured in a direction perpendicular to the plane (28) of the polishing surface (14), from the polishing surface (14) to the lower surface (27) of the sub-pad (25).  (See Figures 1 and 6-10).  The term "window thickness, Tw" as used herein with reference to an end point detection window (30) having a polishing side (31) means the thickness of the point detection window. Final 30 measured in a direction perpendicular to the polishing side (31), the polishing side (31) to the plateau side (32) of the end point detection window (30).  (See Figures 6-10).  [0030] The term "average window thickness, Tw_avg" as used herein with reference to an end point detection window (30) having a polishing side (31) means the average of the window thickness , Tw, measured in a direction perpendicular to the polishing side (31), from the polishing side (31) to the plate side (32) of the end point detection window (30).  (See Figures 6-10).  [0031] The term "polishing layer thickness, Tp" as used herein with reference to a polishing layer (20) having a polishing surface (14) means the thickness of the measured polishing layer. in a direction perpendicular to the polishing surface (14), from the polishing surface (14) to the base surface (17) of the polishing layer (20).  (See Figures 6-10).  [0032] The term "average polishing layer thickness, Tp-avg" as used herein with reference to a polishing layer (20) having a polishing surface (14) means the average of the thickness polishing layer, Tp, measured in a direction perpendicular to the polishing surface (14), from the polishing surface (14) to the base surface (17) of the polishing layer (20).  (See Figures 6-10).  The term "sub-buffer thickness, Te" as used herein with reference to a sub-buffer (25) having an upper surface (26) means the sub-buffer thickness measured in one direction. perpendicular to the upper surface (26), from the upper surface (26) to the lower surface (27) of the sub-pad (25).  (See Figures 6-10).  The term "average subpad thickness, TS-avg" as used herein with reference to a subpad (25) having an upper surface (26) means the average of the sub thickness Buffer, Ts, measured in a direction perpendicular to the upper surface (26), from the upper surface (26) to the lower surface (27) of the sub-pad (25).  (See Figures 6-10).  The term "opening cross-sectional area" as used herein with reference to a given opening (for example, an inner opening cross-sectional area, A 1, a cross-sectional area of central opening, Ac; an external opening cross-sectional area, A0) means the geometric cross-sectional area of the opening in a plane parallel to the plane (28) of the polishing surface.  (See Figure 5)  The term "average cross-sectional area" as used herein with reference to a given aperture (e.g., an average internal opening cross-sectional area, A 1). . . boy Wut; an average cross-sectional area of central opening, Ac-avg; a mean external opening cross-sectional area, Ao-avg) means the average geometrical cross-sectional area of the aperture in a plane parallel to the plane (28) of the polishing layer (20) over the thickness sub-buffer, Ts.  (See Figure 5)  The term "substantially constant" as used herein with reference to a given cross-sectional area (e.g., an inner opening cross-sectional area, AI, a central opening cross-sectional area). , Ac, an externally open cross-sectional area, Ad, an end point detection window cross-sectional area, Wa) means that the cross-sectional area varies by less than 10% over the thickness in question (For example, the smallest cross-sectional area for a given opening parallel to the plane of the polishing surface is 25 k.  0.90 * the largest area in cross-section for this opening parallel to the plane of the polishing surface on the sub-buffer thickness, Ts; the smallest cross-sectional area of the endpoint detection window parallel to the plane of the polishing surface is _.  0.90 * the largest cross-sectional area of the endpoint detection window 30 parallel with the plane of the polishing surface on the window thickness, Tw).  (See Figures 3 and 5).  [0038] The term "substantially constant" as used herein with reference to a given dimension (e.g., aperture width, Aw; aperture length, AL; window length, WL; window width, Ww; an internal opening dimension, Dr, an outer opening dimension, D. ; an internal limb width, Wim; an outer limb width, Wom) means that the dimension varies by less than 10% for the characteristic in question on the thickness in question (for example the smallest length of window is k 0.90 * the greatest length of window of the endpoint detection window on the window thickness, Tw, and on the window width, Ww; the smallest inner member width is 0.90 * the largest internal member width on the window sub-buffer thickness, Ts, and on the opening width, Aw, of the plurality of openings).  (See Figures 1-10).  [0039] The term "substantially coincides with" as used herein with reference to a projection on the plane (28) of the polishing surface (14) (for example, a large window projection, pLDw; a large aperture projection, pLDA) and a radial polishing layer line, PLR, in the plane (28) means that the projection (eg pLDw, pLDA) intersects the radial polishing layer line, PLR, at an angle of 0 to 10 °.  (See Figure 1)  [0040] The term "substantially circular cross-section" as used herein with reference to a chemical-mechanical polishing pad (10) means that the largest radius, r, of the cross-section from the central axis (12) to the outer perimeter (15) of the polishing surface (14) of the polishing layer (20) is 5% longer than the smallest radius, r, of the cross-section from the central axis (12) to 3033 5 12 13 external perimeter (15) of the polishing surface (14).  (See Figure 1)  [0041] The term "polishing medium" as used herein includes polishing solutions containing particles and particle-free polishing solutions, such as non-abrasive and reactive liquid polishing solutions.  The term "polyurethane" as used herein includes (a) polyurethanes formed by the reaction of (i) isocyanates and (ii) polyols (including diols); and (b) polyurethanes formed by the reaction of (i) isocyanates with (ii) polyols (including diols) and (iii) water, amines (including diamines and polyamines) or a combination of water and amines (including diamines and polyamines).  The chemical mechanical polishing pad (10) of the present invention is preferably adapted for rotation about a central axis (12).  Preferably, the chemical-mechanical polishing pad (10) is adapted for rotation in the plane (28) of the polishing surface (14) which forms an angle, y, of 85 to 95 ° (more preferably 88 to 920, particularly preferably 90 °) with the central axis (12).  (See Figures 1 and 11).  Preferably, the chemical-mechanical polishing pad (10) of the present invention is designed to facilitate the polishing of a substrate selected from at least one of a magnetic substrate, an optical substrate and a substrate. a semiconductor substrate.  More preferably, the chemical mechanical polishing pad (10) of the present invention is designed to facilitate polishing of a semiconductor substrate.  The chemical mechanical polishing pad (10) of the present invention comprises: a polishing layer (20) having a central axis (12), an outer perimeter (15), a polishing surface (14), a base surface (17) and a polishing layer thickness, Tp, perpendicular to the plane (28) of the polishing surface (14), measured from the polishing surface (14) to the base surface (17); ); an end point detection window (30) having a polishing side (31), a plateau side (32) and a window thickness, Tw, perpendicular to the polishing side (31), measured from the polishing side (31) to the side tray (32); a sub-pad (25) having an upper surface (26), a lower surface (27), a plurality of openings (40), an outer edge (29) and a sub-pad thickness, Ts, perpendicular to the upper surface (26), measured from the upper surface (26) to the lower surface (27); and a stacking adhesive (23); wherein the end-point detection window (30) is incorporated in the chemical-mechanical polishing pad (10), where the polishing side (31) is disposed towards the polishing surface (14) of the polishing layer (20). ); wherein the stacking adhesive (23) is disposed between the base surface (17) of the polishing layer (20) and the upper surface (26) of the sub-pad (25); wherein the plurality of apertures (40) are in optical communication with the end point detection window (30); and wherein the polishing surface (14) of the polishing layer (20) is adapted to polish a substrate.  (See Figures 1-11).  Preferably, in the electrochemical polishing pad (10) of the present invention, the polishing layer (20) is made of a polymeric material comprising a polymer selected from polycarbonates, polysulfones, nylons, polyethers, polyesters, polystyrenes, acrylic polymers, poly (methyl methacrylates), polyvinyl chlorides, polyvinyl fluorides, polyethylenes, polypropylenes, polybutadienes, polyethylene imines, poly (urethanes), polyethersulfones, polyamides, polyetherimides, polyketones, epoxides, silicones, EPDM, and combinations thereof.  More preferably, the polishing layer 30 comprises a polyurethane.  Particularly preferably, the polishing layer comprises a polyurethane.  Preferably, the polishing layer (20) further comprises a plurality of microelements.  Preferably, the plurality of microelements are dispersed uniformly in the polishing layer (20).  Preferably, the plurality of microelements is selected from entrapped gas bubbles, hollow core polymeric materials, liquid filled hollow core polymeric materials, water soluble materials, insoluble phase material (e.g. mineral oil) and a combination thereof.  More preferably, the plurality of microelements is selected from entrapped gas bubbles and hollow core polymeric materials evenly distributed throughout the polishing layer (20).  Preferably, the plurality of microelements has a weight average diameter of less than 150 μm (more preferably less than 50 μm, particularly preferably 10 to 50 μm).  Preferably, the plurality of microelements comprises polymeric microballoons having polyacrylonitrile shell walls or a polyacrylonitrile copolymer (eg Expancel® from Akzo Nobel).  Preferably, the plurality of microelements are incorporated in the polishing layer (20) at a porosity of 0 to 35 vol% (more preferably at a porosity of 10 to 25 vol%).  One of ordinary skill in the art will know how to choose a polishing layer (20) having a polishing layer thickness, Tp, suitable for use in a chemical-mechanical polishing pad (10) for a given polishing operation.  Preferably, the polishing layer (20) has a mean polishing layer thickness, Tp-avg, perpendicular to the plane (28) of the polishing surface (14).  More preferably, the average polishing layer thickness, TP-avgi is 0.51 to 3.81 mm (20 to 150 mils (1 mil = 10-3 inches = 0.0254 mm)) (more preferably 0 , 76 to 3.30 mm (30 to 130 mils), most preferably 1.78 to 2.29 mm (70 to 90 mils).  (See Figures 6-10).  Preferably, in the electrochemical polishing pad (10) of the present invention, the polishing layer (20) has a polishing surface (14), where the polishing surface (14) has the least one of macrotexture and microtexture to facilitate polishing of a substrate.  Preferably, the polishing surface (14) has a macrotexture, wherein the macrotexture is adapted to achieve at least one of (i) attenuating at least hydroplaning; (ii) influence the flow of polishing medium; (iii) modify the rigidity of the polishing layer; (iv) reduce edge effects; and (y) facilitating the transfer of polishing debris from the area between the polishing surface and the substrate.  Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the polishing layer (20) has a polishing surface (14), where the polishing surface (14) has a selected macrotexture among at least one of the perforations and grooves.  Preferably, the perforations extend from the polishing surface (14) over some or all of the polishing layer thickness, Tp, of the polishing layer (20).  Preferably, the polishing surface (14) has grooves disposed on the polishing surface (14) such that, upon rotation of the polishing pad (10) during polishing, at least one groove sweep the substrate.  Preferably, the grooves are selected from curved grooves, linear grooves and combinations thereof.  The grooves have a depth. k.  0.25 mm (10 mils); preferably from 0.25 to 3.81 mm (10 to 150 mils).  Preferably, the grooves form a groove pattern which comprises at least two grooves having a combination of a depth selected from 0.2 m (10 mils). 0.38 mm (15 mils) and 0.38 to 3.81 mm (15 to 150 mils); a width selected from k 0.25 mm (10 mils) and 0.25 to 2.54 mm (10 to 100 mils); and a step selected from 0.76 mm (30 mils), 1.27 mm (50 mils), 1.27 to 5.10 mm (50 to 200 mils), 1.78 to 5.10 mm (70 to 200 mils), and 2.29 to 5.10 mm ( 90 to 200 mils).  Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the end-point detection window (30) is selected from the group consisting of an integrated window and a window in place. .  More preferably, the endpoint detection window (30) is selected from the group consisting of (a) an integrated window, where the integrated window is embedded in the polishing layer (20) (See Figs. 6-7 ); (b) a window in place, where the installed window is embedded in the chemical-mechanical polishing pad on the sub-pad (25) (See Fig. 8); (c) a window in place, where the installed window is embedded in the chemical-mechanical polishing pad on the stacking adhesive (23) (See FIGS. 9-10).  Particularly preferably, the endpoint detection window (30) is an integrated window, where the integrated window is incorporated into the polishing layer (20) (See Figs. 6-7).  One of ordinary skill in the art will know how to select a suitable building material for the endpoint detection window (30).  [0050] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the final point detection window (30) has a window cross-sectional area, Wa, parallel to the plane (28). of the polishing surface (14), and a mean cross-sectional window area IN - a-avg. Preferably, the window cross-sectional area, Wa, is substantially constant over the window thickness, Tw.  (See Figures 1-3).  [0051] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the end-point detection window (30) has a window length, W1, measured in a large window dimension, LDw the end point detection window (30) parallel to the plane (28) of the polishing surface (14); wherein the endpoint detection window (30) has a window width, Ww, measured in a small window dimension, SDw, of the endpoint detection window (30) parallel to the plane (28) of the polishing surface (14); where the large window dimension, LDw, is perpendicular to the small window dimension, SDw; wherein the polishing layer (20) has a radial polishing layer line, PLR, in the plane (28) of the polishing surface (14) which intersects the central axis (12) and extends through the outer perimeter (15) of the polishing layer (20); wherein the endpoint detection window (30) is embedded in the polishing pad (10) such that the large window dimension, LDw, projects a large window projection, pLDw, on the plane (28). ) the polishing surface (14); where the large window projection, pLDw, substantially coincides with the radial polishing layer line, PLR.  (See Figure 1)  Preferably, the window length, WL, is substantially constant over the window thickness, Tw.  More preferably, the window length, WL, is substantially constant over the window thickness, Tw, and the window width, W.  Preferably, the endpoint detection window (30) has an average window length, WL-avg, over the window thickness, Tw, and the window width, Ww; wherein the average window length, W-L-avg, is 35 to 75 mm (more preferably 44 to 70 mm, more preferably 50 to 65 mm, particularly preferably 55 to 60 mm).  Preferably, the window width, Ww, is substantially constant over the window thickness, Tw.  More preferably, the window width, Ww, is substantially constant over the window thickness, Tw, and the window length, WL.  Preferably, the endpoint detection window (30) has an average window width, Ww-avg, over the window thickness, Tw, and the window length, WL; wherein the average window width, Ww-avg, is 6 to 40 mm (more preferably 10 to 35 mm, more preferably 15 to 25 mm, particularly preferably 19 to 21 mm).  (See Figures 1-3).  Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) comprises a material selected from the group consisting of open-cell foam, cellular foam, and the like. closed, woven material, nonwoven material (e.g., felted, nonwoven and needled materials), and combinations thereof.  The average person skilled in the art will know how to choose a suitable material for use in the sub-pad (25).  [0053] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) are extends from the lower surface (27) of the sub-pad (25) to the upper surface (26) of the sub-pad (25).  (See Figures 6-10).  [0054] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) further comprises a plurality of transverse members (35); wherein the plurality of openings (40) are separated by the plurality of transverse members (35); and wherein the plurality of openings (40) comprises at least three openings.  (See Figures 4-10).  Preferably, in the electro-chemical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) consist of in three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the inner opening (42) has an inner opening cross-sectional area A 1, parallel to the plane (28) of the polishing surface (14); wherein the central aperture (45) has a center aperture cross-sectional area, Ac, parallel to the plane (28) of the polishing surface (14); wherein the outer aperture (47) has an outer aperture cross-sectional area, A0, parallel to the plane (28) of the polishing surface (14); wherein the plurality of transverse members (35) comprises an inner member (33) and an outer member (36); wherein the inner member (33) separates the inner opening (42) from the central opening (45); and wherein the outer member (36) separates the central opening (45) from the outer opening (47).  Preferably, the inner opening cross-sectional area, A 1, is substantially constant over the sub-buffer thickness, Ts.  Preferably, the center opening cross-sectional area, Ac, is substantially constant over the sub-buffer thickness, Ts.  Preferably, the area in cross-section of external opening, A. , is substantially constant over the sub-buffer thickness, Ts.  More preferably, the inner opening cross-sectional area, A 1, is substantially constant over the sub-buffer thickness, Ts; the center opening cross-sectional area, Ac, is substantially constant over the sub-buffer thickness, Ts; and the outside opening cross-sectional area, A0, is substantially constant over the sub-buffer thickness, Ts.  (See Figures 4-10).  Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) has a plurality of openings (40). aperture length, AL, measured in a large aperture size, LDA, of the plurality of apertures (40) parallel to the plane (28) of the polishing surface (14); wherein the plurality of openings (40) has an opening width, Aw, parallel to the plane (28) of the polishing surface (14), measured in a small opening size, Spa, of the plurality of openings (40); where the large aperture dimension, LDA, is perpendicular to the small aperture dimension, SDA; wherein the plurality of openings (40) are integrated in the sub-pad (25) such that the large aperture dimension, LDA, projects a large aperture projection, ILD A, onto the plane (28). ) the polishing surface (14); where the large aperture projection, pLDA, substantially coincides with the large window projection, pLDw.  Preferably, the aperture length, AL, of the plurality of apertures (40) is substantially constant over the sub-buffer thickness, Ts.  More preferably, the aperture length, AL, of the plurality of apertures (40) is substantially constant over the sub-buffer thickness, Ts, and the aperture width, Aw, of the plurality of apertures. openings (40).  Preferably, the plurality of openings (40) has an average opening length, AL-avg, on the sub-pad thickness, Ts, and the opening width, Aw, of the plurality of openings (40); wherein the average opening length, AL-avg, is 28 to 69 mm (preferably 37 to 64 mm, more preferably 43 to 59 mm, particularly preferably 48 to 54 mm).  Preferably, the plurality of openings (40) has an average opening length, AL-avg; WHERE AL-avg -.  W - - L-avg (preferably, AL_avg <WL-avg; more preferably, IN 0.75 * - L-avg AL-avg 0.95 * WL-avg; particularly preferably, 0.85 * - L-avg AL-avg 5- 0.9 * WL-avg). Preferably, the opening width, Aw, of the plurality of openings (40) is substantially constant over the sub-buffer thickness, Ts. More preferably, the aperture width, Aw, of the plurality of apertures (40) is substantially constant over the sub-buffer thickness, Ts, and over the aperture length, AL, of the plurality of apertures. openings (40). Preferably, the plurality of openings (40) has an average opening width, Aw-avg, on the sub-pad thickness, Ts, and on the opening length, AL, of the plurality of openings (40); wherein the average opening width, Aw-avg, is 3 to 34 mm (preferably 5 to 29 mm, more preferably 7.5 to 20 mm, particularly preferably 10 to 15 mm). Preferably, the plurality of openings (40) has a mean opening width, Aw_avg; where Aw_ .._ W Aw-avg - - W-avg (preferably, Aw-avg <Ww_avg; more preferably, 0.5 * Ww-avg 5- Aw-avg 5. 0.75 * Ww_avg; particularly preferably 0.6 * Ww-avg 5- Aw-avg 0.7 * Ww-avg). (See Figures 1-10). Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) consists of three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the inner aperture (42) has an average inner aperture cross-sectional area, Ai-avg, parallel to the plane (28) of the polishing surface (14) over the sub-buffer thickness, Ts; wherein the central aperture (45) has an average central aperture cross-sectional area, Ac-avg, parallel to the plane (28) of the polishing surface (14) over the sub-buffer thickness, Ts; wherein the outer aperture (47) has an average opening mean cross-sectional area, A0-avg, parallel to the plane (28) of the polishing surface (14) over the sub-pad thickness, Ts; and where 0.75 * Aa-avg Ai-avg 1.25 * Ao-avg (preferably, where 0.9 * Ao-avg Ai-avg 1.1 * Ao_avg, more preferably, OÙ 0.95 * Ao-avg Al_avg 1.05 * Ao-avg; particularly preferably, where Ao-avg = Al-avg). (See Figures 4-10). Preferably, in the electrochemical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) consist of in three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the inner aperture (42) has an average inner aperture cross-sectional area, Ai-avg / parallel to the plane (28) of the polishing surface (14) over the sub-buffer thickness, Ts; wherein the central aperture (45) has a center mean aperture cross-sectional area, Ac-avg, parallel to the plane (28) of the polishing surface (14) over the sub-pad thickness, Ts; wherein the outer aperture (47) has an average outside opening cross-sectional area, A0-avg, parallel to the plane (28) of the polishing surface (14) on the sub-pad thickness, ts; and wherein 0.5 * (Al-avg + Ao-avg) 5 Ac 1.25 * (Al-avg + Ao-avg) (preferably, where 0.75 * (Al-avg + Ao-avs) avg 5 1.1 * (Al-avg + Ao-avg); still more preferably, where 0.9 * (Al.sub.avg + Al.sub.avg) .about..about..about.0.95 * (Al.sup.-avg.sup.-Avg) ). (See Figures 4-10). Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) consist of Three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the inner aperture (42) has an average inner aperture cross-sectional area, Ai-avg, parallel to the plane (28) of the polishing surface (14) over the sub-buffer thickness, Ts; Wherein the central opening (45) has a mean aperture mid-sectional area, Ac-avg, parallel to the plane (28) of the polishing surface (14) over the sub-pad thickness, Ts; wherein the outer aperture (47) has an average opening mean cross-sectional area, Ao-avgr parallel to the plane (28) of the polishing surface (14) on the sub-pad thickness, Ts; where 0.75 * Ao-avg 5 Ai-avg _. 1.25 * Ao-avg (preferably, where 0.9 * A.-avg 5. Ai-avg 5 1.1 * Ac-avg, more preferably, where 0.95 * Ao_avg 5 .. Ai-avg 1.05 * AO-avg; particularly preferably, where Ao-avg = Al-avg); and wherein 0.5 * (14.avg + A..avg) 5 Ac 5. 1.25 * (Al-avg + Ao-avg) (preferably, where 0.75 * (Al-avg + Ao-avg) avg) 5 Ac-avg 5 1.1 * (Al-avg + Ao-avg), more preferably, where 0.9 * (Ai-avg + Ao-avg) -5 Ac-avg 0.95 * (Ai_avg) + A-avg)). (See Figures 4-10). [0060] Preferably, in the electrochemical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) are provided. ) consists of three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the inner opening (42) has an internal opening dimension, Di, parallel to the plane (28) of the polishing surface (14) measured according to the large opening dimension, LDA, of the plurality of openings (40). Preferably, the internal aperture dimension, Di, is substantially constant over the sub-buffer thickness, Ts. More preferably, the internal aperture dimension, Di, is substantially constant over the sub-buffer thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40). Preferably, the inner opening (42) has an average internal opening size, Di-avg, on the sub-pad thickness, Ts, and the opening width, Aw, of the plurality of openings (40); wherein the average internal opening size, Di-avg, is 2 to 10 mm (preferably 2.5 to 7.5 mm, more preferably 3 to 5 mm, particularly preferably 3.5 to 4 mm). (See Figures 1 and 4-5). [0061] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of openings (40), where the plurality of openings (40) consist of in three adjacent openings (41); wherein the three adjacent openings (41) consist of an inner opening (42), a central opening (45) and an outer opening (47); wherein the outer aperture (47) has an outer aperture dimension, Do, parallel to the plane (28) of the polishing surface (14) measured according to the large aperture dimension, LDA, of the plurality of apertures (40). Preferably, the outer aperture dimension, C, is substantially constant over the sub-buffer thickness, Ts. More preferably, the outer aperture dimension, C, is substantially constant over the sub-pad thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40). Preferably, the outer aperture (47) has an average external aperture size, C avav, on the sub-pad thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40); wherein the average external opening size, Cd-avg, is 2 to 10 mm (preferably 2.5 to 7.5 mm, more preferably 3 to 5 mm, particularly preferably 3.5 to 4 mm). (See Figures 1 and 4-5). Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the sub-pad (25) has a plurality of transverse members (35); wherein the plurality of transverse members (35) consists of an inner limb (33) and an outer limb (36); wherein the inner member (33) separates the inner opening (42) from the central opening (45); and wherein the outer member (36) separates the central opening (45) from the outer opening (47). Preferably, the inner limb (33) has an internal limb width, Wim, parallel to the plane (28) of the polishing surface (14), measured according to the large aperture dimension, LDA, of the plurality of openings (40). Preferably, the inner limb width, Wim, is substantially constant over the sub-buffer thickness, Ts. More preferably, the inner limb width, Wim, is substantially constant over the sub-pad thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40). Preferably, the inner limb (33) has an average internal limb width, WIM-avg, over the sub-tampon thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40). ); where the average inner limb width, W - is 1 to 10 mm; preferably 2 to 6 mm; more preferably 2.5 to 5 mm; particularly preferably 3 to 4 mm. Preferably, the outer limb (36) has an outer limb width, Wom, parallel to the plane (28) of the polishing surface (14), measured according to the large aperture dimension, LDA, of the plurality of openings (40). Preferably, the outer limb width, Wom, is substantially constant over the sub-buffer thickness, T. More preferably, the outer limb width, Wom, is substantially constant over the sub-buffer thickness , Ts, and on the opening width, Aw, of the plurality of openings (40). Preferably, the outer limb (36) has an average outer limb width, Wom_an, on the sub-pad thickness, Ts, and the aperture width, Aw, of the plurality of apertures (40). ; wherein the average external limb width, Wom-avg, is 1 to 10 mm (preferably 2 to 6 mm, more preferably 2.5 to 5 mm, particularly preferably 3 to 4 mm). [0063] Preferably, in the chemical-mechanical polishing pad (10) of the present invention, the stacking adhesive (23) disposed between the base surface (17) of the polishing layer (20) and the The upper surface (26) of the sub-pad (25) is an adhesive selected from the group consisting of pressure sensitive adhesives, reactive hot melt adhesives, contact adhesives and combinations thereof. More preferably, the stacking adhesive (23) is selected from the group consisting of reactive hot melt adhesives and pressure sensitive adhesives. Particularly preferably, the stacking adhesive (23) is a reactive hot melt adhesive. Preferably, the reactive hot melt adhesive is a cured reactive hot melt adhesive which has an uncured melting temperature of 50 to 150 ° C (preferably 115 to 135 ° C) and a turnaround time of 5%. 90 minutes after the merger. Most preferably, the reactive hot melt adhesive is a polyurethane resin (eg, Mor-Melton® R5003 available from Rohm and Haas Company). [0064] Preferably, the chemical mechanical polishing pad (10) of the present invention further comprises a pressure sensitive platen adhesive layer (70); wherein the pressure-sensitive tray adhesive is disposed on the lower surface (27) of the sub-pad (25).
    [0002] More preferably, the chemical-mechanical polishing pad (10) of the present invention further comprises a pressure-sensitive tray adhesive layer (70) and a separating layer (75); wherein the pressure-sensitive tray adhesive is disposed on the lower surface (27) of the sub-pad (25); and wherein the pressure-sensitive tray adhesive layer (70) is disposed between the separating layer (75) and the lower surface (27) of the sub-pad (25). One of ordinary skill in the art will be able to choose a suitable pressure sensitive adhesive material and a separation layer material suitable for use in the chemical mechanical polishing pad (10) of the present invention. [0065] Preferably, the polishing method of the present invention comprises: providing a chemical mechanical polishing apparatus having a table, a light source and a photosensor; providing a substrate; providing a mechanical polishing pad of the present invention; the installation on the table of the chemical-mechanical polishing pad with the polishing surface disposed at a distance from the table; optionally, providing a polishing medium at an interface between the polishing surface and the substrate; creating a dynamic contact between the polishing surface and the substrate, wherein at least a certain amount of material is removed from the substrate; and determining a polishing end point by transmitting light from the light source through the end-point detection window and analyzing the light reflected from the substrate, which again passes through the end-point detection window and which is incident on the photosensor. Preferably, the substrate is selected from the group consisting of at least one of a magnetic substrate, an optical substrate and a semiconductor substrate. More preferably, the substrate is a semiconductor substrate. Some embodiments of the present invention will now be described in detail in the following examples.
    [0003] Comparative Example C1 and Examples 1-5: Polishing Pads [0067] The polishing pad used in Comparative Example C1 was an unmodified commercial polishing pad IC1010111 available from Rohm and Haas Electronic Materials Inc. CMP Inc. The polishing pads used in Examples 1-5 were commercial polishing pads IC1010-Tm available from Rohm and Haas Electronic Materials CMP Inc., where the sub-pad structure was modified with sub-material fragments. buffer to obtain a sub-pad having a plurality of apertures Specifically, the subpad structure for the polishing pad used in Example 1 was modified to have a plurality of apertures (40) configured as indicated in FIG. Figure 12, where the plurality of openings (40) were two identical cross-sectional area openings (50) separated by a transverse member (60) having an average limb width The structure of the sub-pad for the polishing pad used in Example 2 was modified to have a plurality of apertures (40) configured as shown in Fig. 12, where the plurality of apertures (40) configured as shown in Fig. apertures (40) were two identical cross-sectional area apertures (50) separated by a transverse member (60) having an average limb width, Wri-avg, of 5.08 mm. The subpad structure for the polishing pad used in Example 3 was modified to have a plurality of apertures (40) configured as shown in Fig. 5, where the plurality of apertures (40) were an outer aperture (47), a central opening (45) and an inner opening (42); wherein the outer opening (47) is separated from the central opening (45) by an outer transverse member (36); wherein the central opening (45) was separated from the inner opening (42) by an inner transverse member (33); where the outside opening cross-sectional area, A., and the internal opening cross-sectional area, A 1, were equal; where the average internal limb width, IN-IM-avgl was 3.81 3033512 29 mm; where the average external limb width, Wom_avg, was 3.81 mm; where the average internal opening size, Di-avg, was 15 mm; and where the average external opening size, C-avg, was 15 mm. The subpad structure for the polishing pad used in Example 4 was modified to have a plurality of openings (40) configured as shown in Fig. 13, where the plurality of openings (40) were two openings of identical cross-sectional area (50) separated by a diagonal transverse member (60) having a mean cross-sectional width, Wm-avg, of 2.54 mm. The sub-pad structure for the polishing pad used in Example 5 was modified to have a plurality of openings (40) configured as shown in Fig. 14, where the plurality of openings (40) were two openings identical cross sectional area (50) and a third opening (55); wherein the plurality of openings (40) were separated by two diagonal cross members (60); where the diagonal transverse members (60) both had an average transverse limb width Wm_avg of 3.81 mm. Abrasive Conditioning [0068] The chemical mechanical polishing pads prepared according to each of Comparative Example C1 and Examples 1-5 were mounted on the platen of a 200 mm Mirra® Applied Materials polishing apparatus set with 9 kPa press force, 200 ml / min deionized water flow, 93 rpm table rotation speed, 87 rpm carrier rotation speed, and diamond packing disc AMO2BSL8031C1-PM (AK45) (commercially available from Saesol Diamond Ind. Co., Ltd.). Each of the chemical mechanical polishing pads was then continuously conditioned for six hours. The percentage intensity of the initial signal, detected with an ISRM EPD (end-point detection point) detection system and the Applied 3033512 Materials 200 mm Mirra® polishing apparatus, and the The percentage intensity of the post-conditioning signal is shown in Table 1. TABLE 1 Ex. Initial signal (0/0) Post-conditioning signal (1/4 '). Cl 54-56 34-37 1 36-40 24 2 28 18 3 50 27 4 43 27 5 40 27 5 The window thickness of the end point detection window (30) of comparative example C1 and Example 3 was measured before and after conditioning along the middle line (61) in the middle (65), at the anterior edge (63) and at the posterior edge (67); and 10 along the outer middle line (62) (65), at the front edge (63) and at the rear edge (67). (See Figure 15) The results are shown in Table 2. TABLE 2 Ex. State of Window Thickness, Tw (in mm) conditioning Front edge Middle Central posterior edge extentrate central extene external Cl pre 2,17 2,17 2,17 2 , 17 2,17 2,17 Cl post 1,72 1,78 1,71 1,75 1,72 1,79 3 pre 2,18 2,18 2,18 2,18 2,18 2,18 3 post 1.78 1.78 1.77 1.79 1.78 1.78
    权利要求:
    Claims (10)
    [0001]
    REVENDICATIONS1. A chemical mechanical polishing pad characterized in that it comprises: a polishing layer (20) having a central axis (12), an outer perimeter (15), a polishing surface (14), a base surface (17) and a polishing layer thickness, Tp, perpendicular to the plane (28) of the polishing surface (14), measured from the polishing surface (14) to the base surface (17); an end point detection window (30) having a polishing side (31), a platen side (32) and a window thickness, Tw, perpendicular to the polishing side measured from the polishing side (31) to the platen side (32); a sub-pad (25) having an upper surface (26), a lower surface (27), a plurality of openings (40), an outer edge (29) and a sub-pad thickness, Ts, perpendicular to the upper surface measured from the upper surface (26) to the lower surface (27); and a stacking adhesive (23); wherein the end-point detection window (30) is incorporated in the chemical-mechanical polishing pad (10), where the polishing side (31) is disposed towards the polishing surface (14) of the polishing layer (20) ; wherein the stacking adhesive (23) is disposed between the base surface (17) of the polishing layer (20) and the upper surface (26) of the sub-pad (25); wherein the plurality of apertures (40) are in optical communication with the end point detection window (30); and wherein the polishing surface (14) of the polishing layer (20) is adapted to polish a substrate. 3033512 32
    [0002]
    2. Chemical mechanical polishing pad according to claim 1 characterized in that the plurality of openings (40) extends from the lower surface (27) of the sub-pad (25) to the upper surface (26) of the sub -tampon (25). 5
    [0003]
    3. Chemical mechanical polishing pad according to any one of the preceding claims characterized in that the sub-pad (25) further comprises a plurality of transverse members (35); wherein the plurality of openings (40) are separated by the plurality of transverse members (35); and wherein the plurality of openings comprises at least three openings.
    [0004]
    4. Chemical mechanical polishing pad according to claim 3 characterized in that the plurality of openings consists of three adjacent openings (41); The three adjacent openings consist of an inner opening (42), a central opening (45) and an outer opening (47); the inner opening (42) has an inner opening cross-sectional area Ai, parallel to the plane of the polishing surface; the central aperture (45) has a center aperture cross-sectional area, Ac, parallel to the plane of the polishing surface; the outer opening (47) has an external opening cross-sectional area, A., parallel to the plane of the polishing surface; the plurality of transverse members consists of an inner limb (33) and an outer limb (36); the inner member (33) separates the inner opening (42) from the central opening (45); and the outer member (36) separates the central opening (45) from the outer opening (47).
    [0005]
    The chemical mechanical polishing pad of claim 4 characterized in that the inner opening cross-sectional area, AI, is substantially constant over the sub-pad thickness, Ts; the center opening cross-sectional area, Ac, is substantially constant over the sub-buffer thickness, Ts; and the external opening cross-sectional area, A0, is substantially constant over the sub-buffer thickness, Ts.
    [0006]
    6. chemical mechanical polishing pad according to claim 5 characterized in that the outer opening (47) has an average cross-sectional area of external opening, A ... g, parallel to the plane of the polishing surface on the sub-buffer thickness, Ts; The inner opening (42) has an average inner opening cross-sectional area, A 1..avg, parallel to the plane of the polishing surface on the sub-pad thickness, Ts; the central aperture (45) has an average central aperture cross-sectional area, Ac-avg, parallel to the plane of the polishing surface on the sub-buffer thickness, Ts; and 0.75 * Ao-avg: 5 Ai-avg 1.25 * Ao-avg; and 0.5 * (Al-avg + Ao-avg) 5. Ac 5 1.25 * (Al-avg + Ao-avg).
    [0007]
    A chemical mechanical polishing pad according to any one of claims 1 to 6, characterized in that the end point detection window (30) has a window cross-sectional area, Wa, parallel to the plane (28). the polishing surface (14); where the window cross-sectional area, Wa, is substantially constant over the window thickness, Tw.
    [0008]
    8. Chemical mechanical polishing pad according to claim 7, characterized in that the end point detection window (30) has a window length, W1, parallel to the plane of the polishing surface, measured along a large dimension of window, LDw, from the endpoint detection window; The end point detection window has a window width, Ww, parallel to the plane (28) of the polishing surface (14) measured in a small window size, SDw, of the end point detection window; The large window dimension, LDw, is perpendicular to the small window dimension, SDw; the polishing layer (20) has a radial polishing layer line, PLR, in the plane (28) of the polishing surface (14) which intersects the central axis (12) and extends through the outer perimeter (15) the polishing layer; the end point detection window is incorporated in the chemical mechanical polishing pad (10) such that the large window dimension, LDw, projects a large window projection, pLDw, on the plane of the surface of the polishing; where the large window projection, pLDw, substantially coincides with the radial polishing layer line, PLR; the plurality of apertures (40) has an aperture length, AL, parallel to the plane of the polishing surface, measured along a large aperture dimension, LDA, of the plurality of apertures; The plurality of apertures (40) has an aperture width, Aw, parallel to the plane of the polishing surface, measured in a small aperture dimension, SDA, of the plurality of apertures; the large aperture dimension, LDA, is perpendicular to the small aperture dimension, SDA; and the plurality of openings (40) is integrated in the sub-pad (25) such that the large aperture dimension, LDA, projects a large aperture projection, pLDA, onto the plane (28). ) the polishing surface (14); where the large aperture projection, pLDA, substantially coincides with the large window projection, pLDw. 3033512
    [0009]
    9. chemical mechanical polishing pad according to any one of claims 4 to 8 characterized in that the inner member (33) has an internal limb width, Wim, parallel to the plane (28) of the polishing surface (14). ), measured according to the large aperture dimension, LDA, of the plurality of apertures; the outer member (36) has an outer limb width, Wom, parallel to the plane (28) of the polishing surface (14), measured according to the large aperture dimension, LDA, of the plurality of apertures; the inner opening (42) has an internal opening dimension, Di, parallel to the plane (28) of the polishing surface (14), measured according to the large opening dimension, LDA, of the plurality of openings ; the outer opening (47) has an external opening dimension, C, parallel to the plane (28) of the polishing surface (14), measured according to the large opening dimension, LDA, of the plurality of openings; The opening length, AL, of the plurality of openings (40) is substantially constant over the sub-pad thickness, Ts, and the opening width, Aw, of the plurality of openings (40); ); the plurality of openings (40) has an average opening length, AL_avg, on the sub-pad thickness, Ts, and on the opening width, Aw, of the plurality of openings (40); the opening width, Aw, of the plurality of openings (40) is substantially constant over the sub-pad thickness, Ts, and the opening length, AL, of the plurality of openings (40) ; the plurality of apertures (40) has a mean aperture width, Aw_avg, for the plurality of apertures (40) on subpad thickness, Ts, and aperture length, AL, of the plurality of openings (40); and AL-avg WL-avg; and Aw-avg WW-avg-
    [0010]
    10. Polishing process characterized in that it comprises: providing a chemical-mechanical polishing apparatus having a table, a light source and a photosensor; providing a substrate; providing a chemical mechanical polishing pad (10) as claimed in any one of the preceding claims; installing on the table the chemical mechanical polishing pad with the polishing surface (14) disposed away from the table; optionally, providing a polishing medium at an interface between the polishing surface and the substrate; Creating a dynamic contact between the polishing surface and the substrate, wherein at least a certain amount of material is removed from the substrate; and determining a polishing end point by transmitting light from the light source through the end point detection window (30) and analyzing the light reflected from the substrate, which again passes through the detection window of end point and which is incident on the photosensor.
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    FR2988316A1|2013-09-27|METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS INCLUDING A WINDOW
    FR3037835A1|2016-12-30|FORMULATION OF MECANO-CHEMICAL POLISHING PILL POLISHING LAYER COMPOSITION
    US20010031610A1|2001-10-18|Polishing pad with a transparent portion
    FR3037836A1|2016-12-30|
    FR3006218A1|2014-12-05|STACK FORMING A SOFT AND CONDITIONABLE MECHANICAL CHEMICAL POLISHING PAD
    CN102481679A|2012-05-30|Supporting pad
    US9457449B1|2016-10-04|Chemical mechanical polishing pad with composite polishing layer
    TWI597127B|2017-09-01|Workpiece grinding device
    FR3056430A1|2018-03-30|MECHANICAL CHEMICAL POLISHING PAD HAVING UNIFORM SURFACE MICROTEXTURE
    CN105729326A|2016-07-06|Method of manufacturing chemical mechanical polishing pads
    US20210402556A1|2021-12-30|Cmp polishing pad with uniform window
    同族专利:
    公开号 | 公开日
    JP6888912B2|2021-06-18|
    US9446498B1|2016-09-20|
    TWI696517B|2020-06-21|
    CN105965382A|2016-09-28|
    DE102016002339A1|2016-09-15|
    CN105965382B|2018-05-22|
    KR20160110190A|2016-09-21|
    TW201632302A|2016-09-16|
    US20160263721A1|2016-09-15|
    JP2016168670A|2016-09-23|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    CN109794849A|2017-11-16|2019-05-24|罗门哈斯电子材料Cmp控股股份有限公司|Polishing pad with pad wear indicator|US5605760A|1995-08-21|1997-02-25|Rodel, Inc.|Polishing pads|
    JP2003133270A|2001-10-26|2003-05-09|Jsr Corp|Window material for chemical mechanical polishing and polishing pad|
    US7764377B2|2005-08-22|2010-07-27|Applied Materials, Inc.|Spectrum based endpointing for chemical mechanical polishing|
    US7520797B2|2005-09-06|2009-04-21|Freescale Semiconductor, Inc.|Platen endpoint window with pressure relief|
    WO2007091439A1|2006-02-06|2007-08-16|Toray Industries, Inc.|Abrasive pad and abrasion device|
    US8182312B2|2008-09-06|2012-05-22|Strasbaugh|CMP system with wireless endpoint detection system|
    US8083570B2|2008-10-17|2011-12-27|Rohm And Haas Electronic Materials Cmp Holdings, Inc.|Chemical mechanical polishing pad having sealed window|
    JP5474093B2|2009-01-16|2014-04-16|アプライドマテリアルズインコーポレイテッド|Polishing pad having window support and polishing system|
    CN101934150A|2009-06-29|2011-01-05|鸿富锦精密工业（深圳）有限公司|Pupil imitation mechanism and toy eyes|
    US9108290B2|2013-03-07|2015-08-18|Rohm And Haas Electronic Materials Cmp Holdings, Inc.|Multilayer chemical mechanical polishing pad|USD785339S1|2014-10-23|2017-05-02|Griot's Garage, Inc.|Hand applicator buffing pad|
    US10569383B2|2017-09-15|2020-02-25|Rohm And Haas Electronic Materials Cmp Holdings, Inc.|Flanged optical endpoint detection windows and CMP polishing pads containing them|
    法律状态:
    2017-02-13| PLFP| Fee payment|Year of fee payment: 2 |
    2018-02-23| PLFP| Fee payment|Year of fee payment: 3 |
    2019-02-13| PLFP| Fee payment|Year of fee payment: 4 |
    2019-08-23| PLSC| Search report ready|Effective date: 20190823 |
    2021-02-19| RX| Complete rejection|Effective date: 20210113 |
    优先权:
    申请号 | 申请日 | 专利标题
    US14/657,123|US9446498B1|2015-03-13|2015-03-13|Chemical mechanical polishing pad with window|
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